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Chemical Mechanical Polishing (CMP) for Hybrid Bonding

April 25 @ 12:00 pm - 1:00 pm PDT

[]This talk provides a comprehensive overview of Chemical Mechanical Polishing (CMP) for Hybrid Bonding in semiconductor manufacturing. CMP is defined as a technique that combines chemical and mechanical forces to planarize films. The role of CMP in hybrid bonding (HB) is explored, emphasizing its significance in achieving controlled dishing and surface roughness. Key challenges in CMP for HB, such as scratches, dishing, and loading are addressed along with strategies for managing them. The talk concludes by emphasizing the importance of co-optimization of CMP for HB and its implications in semiconductor manufacturing and advanced packaging.
Speaker(s): Sameer Deshpande,
Virtual: https://events.vtools.ieee.org/m/415268

Details

Date:
April 25
Time:
12:00 pm - 1:00 pm PDT
Event Categories:
,
Website:
https://events.vtools.ieee.org/m/415268

Details

Date:
April 25
Time:
12:00 pm - 1:00 pm PDT
Event Categories:
,
Website:
https://events.vtools.ieee.org/m/415268
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