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Introduction to Camera Technology: Packaging Challenges

June 22, 2023 @ 11:30 am - 1:00 pm PDT

Cameras have become key sensors in many products, e.g., cellphones, automotive, and AR/VR. Though cameras were traditionally invented to mimic human perception, the recent development of artificial intelligence (AI) enabled cameras in an increasing number of computer vision applications (e.g., gesture control, object detection), which also brings additional challenges in camera development and packaging. This talk will first provide a brief introduction to the camera system, including both camera module hardware and the image processing pipeline, and then discuss how different applications affect camera development and packaging.
Speaker(s): Zack Lai,
SEMI World Hdqtrs, 673 S Milpitas Blvd, Milpitas, California, United States, 95035, Virtual: https://events.vtools.ieee.org/m/361749

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