Fan-out Wafer and Panel Level Packaging are gaining relevance as high-volume-compatible advanced packaging technologies. Providing technical advantages and optimized cost for manifold applications, FOWLP and PLP are fundamentally changing the packaging infrastructure. In the past, OSATs dominated high-volume manufacturing, but recently new players in packaging such as semiconductor foundries, PCB or LCD manufacturing companies entered this business area and are changing not only supply chains but also form factors towards larger areas. However, materials are playing an important role especially for future applications such as RF, power or advanced computing applications. In addition, materials are also a key factor for cost and sustainability. In summary, the presentation will discuss recent technical developments as well as the changing ecosystem and actual advantages and challenges when moving to large-panel-level manufacturing.
Speaker(s): Tanja Braun,
Virtual: https://events.vtools.ieee.org/m/353528
Material Trends in Fan-out WLP (Wafer Level Package) and PLP (Panel Level Package)
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