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Tutorial: Reliability Testing and Design for Reliability of Packaging Interconnects

January 5 @ 8:00 am - 10:00 am

Recent advances and trends in lead-free solder joint reliability are presented in this study. Emphasis is placed on the design for reliability (DFR) and reliability testing and data analysis, including: Norton power creep constitutive equations and examples; the Wises two power creep constitutive equations and examples; the Garofalo hyperbolic sine creep constitutive equations and examples; and the Anand viscoplasticity constitutive equations and examples, with temperature and strain rate-dependent parameters. For reliability testing and data analysis, the Weibull and lognormal life distributions for lead-free solder joints under thermal-cycling and drop tests; the true Weibull slope, true characteristic life, and true mean life; and the linear acceleration factors for various lead-free solder alloys based on frequency and maximum temperature, dwell time and maximum temperature; and frequency and mean temperature will be presented. Some recommendations will also be provided. Speaker(s): John H Lau, Virtual: https://events.vtools.ieee.org/m/336536

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