New Directions and Challenges in the Packaging of AR/VR Hardware
SEMI 673 South Milpitas Boulevard, Milpitas, CA-- wearable computing, AR Processing, Display & Imaging, Low-energy Wireless, WLP, TSV, ecosystems ...Rajendra (Raj) […]
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-- wearable computing, AR Processing, Display & Imaging, Low-energy Wireless, WLP, TSV, ecosystems ...Rajendra (Raj) […]
This presentation discusses the wide range of properties relevant to carrier performance in wafer thinning […]
-- introduction of hybrid bonding technology, how it enables disaggregation and heterogeneous integration and helps […]
Guidelines about design rules and accelerated tests for electromigration (EM)-induced failure, based on fully coupled […]
In advanced packaging, as newer forms of interconnects emerge to meet the demand for high […]
The lithium-ion battery (LIB) features structural and chemical complexities across a broad range of length […]
Symposium on Reliability for Electronics and Photonics Packaging Fourth year of this new Symposium from […]
The speaker is unable to make the presentation on December 7; we hope to reschedule […]
This talk will cover major developments within additive manufacturing as applied towards electronics packaging needs […]
Future Vision for Heterogeneous Integration from Global Perspectives, 2 days, 8 keynote talks, working groups […]
Joana Mendes will present a detailed background on current status of diamond film development. Artificial […]
As glass is gaining a lot of attention and momentum as a state of the […]
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